Defect Detection: High-res lenses for particles, scratches, and pattern flaws

Dimensional Accuracy: Telecentric optics for line width and overlay measurement

Surface Profiling: Beam combiners for thickness and topography analysis

AOI Systems: Vision optics for real-time alignment and defect checks

Spectral Tools: Optics for ellipsometry, Raman, and PL testing

Cleanroom Assemblies: Vibration-stable, contamination-controlled systems

Subsurface Mapping: Optics for fast, non-destructive laser and X-ray scans

DUV & EUV Lenses: High-transmission optics for 193 nm and 13.5 nm lithography

Projection Systems: Catadioptric assemblies for sub-micron pattern transfer

Mask Illumination: Uniform beam shaping for consistent wafer exposure

Exposure Control: Optics for precise dose delivery and CD accuracy

Anti-Reflective Coatings: Thin films to reduce standing waves and enhance fidelity

Cleanroom Materials: UV-grade fused silica and CaF₂ for durability

Stable Mounts: Vibration-resistant, thermally stable opto-mechanics

Overlay Alignment: Optical sensors for multi-layer registration

Raman: Maps stress, strain, doping, and crystal quality via laser excitation

PL (Photoluminescence): Reveals bandgap, defects, and exciton behavior through emission analysis

Ellipsometry: Measures thin-film thickness, refractive index, and uniformity with polarized light

OES (Optical Emission): Monitors plasma processes in etching, deposition, and chamber cleaning

UV-Vis & IR: Characterizes absorption, transmission, and reflectance across layers

CL (Cathodoluminescence): Detects crystal defects and electronic transitions via electron excitation

Quantum Analysis:

Thin-Film Metrology: Ellipsometry and reflectometry for angstrom-level film and index measurements

Surface Uniformity: Interferometry detects flatness, roughness, and refractive index shifts

Defect Inspection: AOI optics identify particles, scratches, and pattern flaws in real time

Tool Calibration: Standards verify inspection accuracy and contamination control

Scatterometry (OCD): Measures nanoscale features beyond image-based techniques

Spectroscopic Testing: Raman and PL optics assess crystal quality and strain

Inline Monitoring: Optical sensors track excursions and optimize yield during production